Xiaomi expands its portfolio at both ends of the market spectrum. While the Redmi R70 series targets users looking for maximal utility value and extreme endurance in the segment of affordable 5G devices, the upcoming flagship Redmi K90 Max has the ambition to define a new standard of gaming performance thanks to innovative active cooling.
Redmi R70 and Redmi R70m
On the official Chinese website Xiaomi specifications of new models have quietly emerged Redmi R70 5G a Redmi R70m 5GThis pair is a clear answer to the demand for cheap 5G smartphones with a generous diagonal. Both models will impress 6,9-inch LCD panel with smooth 120Hz refresh rate. Although the resolution 720p + (HD+) indicates belonging to a lower class, for a common consomacboth content and social networks, it is a reasonable compromise in favor of endurance.
Inside both chipsets Unisoc T8300, manufactured with a 6nm process that is second to memory standards LPDDR4x and storage UFS 2.2. The real selling point, however, is the battery life. The standard Redmi R70 has 7,300mAh batteries, while varianta Redmi R70m goes even further with capacity 6 300 mAh.
Both phones run on the latest interface HyperOS 3, built on Android 16, which guarantees an up-to-date software environment even at this price level.
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Redmi K90 Max: Gaming beast with active fan
While the Redmi R70 models play on the note of affordability, Redmi K90 Max, whose premiere is scheduled for 21. April, represents the technological pinnacle of the brand. The heart of the device is the most advanced chipset Dimensity 9500. Developers from Redmi they also added a dedicated D2 graphics coprocessorThis tandem architecture enables advanced image editing and AI upscaling, thanks to which the phone achieves up to 165 fps even in titles that do not support such a frequency themselves.
The visual experience will ensure 6,83-inch OLED panel is 165Hz refresh rate and extremely low touch latency. To maintain peak performance without overheating, Xiaomi deploys a revolutionary element: integrated fan with vertical air flow.
Despite the presence of active moving parts, the device should maintain a high level of protection against dust and water. The assembly is complemented by the fastest available memories LPDDR5X and flash storage UFS 4.1Pricing has not yet been announced, nor has global availability been confirmed.
